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Rapid prototyping capability (THT, SMT, assembly)
Materials procurement capability from multiple suppliers
0402 to BGA placement capability
On site X-ray inspection system
Lead free SMT soldering capability
Final product assembly
Wire Harness division with automated cut/strip
Specialist assembly processes including potting, encapsulation, cable assembly, wire wrapping
Universal firmware programming Capability
Workmanship to IPC-610 - J STD Class 3
Circuit Card Manufacturing
PCB assembly is a core part of our electronic manufacturing services. This capability can be utilized at all levels from the initial production of very low volume, rapid prototype products, through to the ongoing manufacture of complex, multi-technology PCB assemblies.
PCB assembly services include:
Prototype & Rapid Turn-Around PCB Assembly
We have the ability to offer prototype and rapid turn around PCB assembly for surface mount, mixed technology and conventional PCB assemblies.
BGA & Surface Mount PCB Assembly
Our surface mount PCB assembly capabilities include BGA, 0402, QFN, TQFP and much more. Automated assembly processes are utilized throughout all stages of the manufacturing cycle to ensure consistent, sustained quality.
Mixed Technology & Through-Hole PCB Assembly
We have full capability for assembling both Through-Hole and mixed technology PCB assemblies. In addition, we can offer device programming and the configuration of PCB assemblies prior to system integration.
Wire Harness Manufacturing
Price Electronics offers a full wire harness manufacturing line with an automated cut and strip line. Several applicators and presses are available for a variety of connectors/terminals.
An in house engineering group can produce custom test fixtures for complex assemblies.
Lead Free PCB Assembly
Due to environmental concerns and EU Legislation Lead Free is being more popular and even required on certain electronic assemblies.
During our extensive research into lead free production processes, Price Electronics has built on existing expertise, and is currently able to offer:
Assistance with the choice of different grades of FR4 laminates and alternative materials to deal with the higher soldering temperatures and increased number of thermal cycles.
The ability to source Lead free components and offer substitutes for current assemblies.
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